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Elektronik und Systemintegration

Design and Characterization of a Low-Inductive 500 A Power Module Using TO-263 SiC MOSFETs on an Insulated Metal Substrate

Autoren

Bernhard Jahn
Bernhard.Jahn@haw-landshut.de
Prof. Dr. Alexander Kleimaier
Alexander.Kleimaier@haw-landshut.de

Medien

CIPS - International Conference on Integrated Power Electronics Systems, Dresden, Mar. 2026

Veröffentlichungsjahr

2026

Veröffentlichungsart

Konferenzbeitrag (peer reviewed)

Zitierung

Jahn, Bernhard; Kleimaier, Alexander (2026): Design and Characterization of a Low-Inductive 500 A Power Module Using TO-263 SiC MOSFETs on an Insulated Metal Substrate. CIPS - International Conference on Integrated Power Electronics Systems, Dresden, Mar. 2026.

Peer Reviewed

Ja

Elektronik und Systemintegration

Design and Characterization of a Low-Inductive 500 A Power Module Using TO-263 SiC MOSFETs on an Insulated Metal Substrate

Abstract