The Application of an acoustic based, non-contact measurement system to visualization of vibration modes of electronic boards is described. This technique can be used to assist in interpretation of vibrational measurements during design phase and therefore can lead to reduction of mechanical stress to the board by helping to optimize positions of components. On the other hand, the low measurement time of the presented system achievable due to the high paralleling of acquisition and processing channels makes the method potentially suitable for the in-line inspection in the production phase. Results of acoustic vibration measurements are presented and compared with data recorded by laser vibrometry. Practical aspects, characteristics, advantages and limitations of the described approach are discussed.